CHIPMATE

Description

The Chipmate is the entry configuration. Manual operation with a hand-held vacuum tool and thermocouple board sensing, with the full focused infrared heating system.
 

DESCRIPTION

• Focused infrared heating. 150W focused, adjustable, visible infrared delivers precise energy exactly where it is needed.
• Independent temperature control. Board and component temperatures are managed separately, for full control of the procedure.
• ThermoActive software. Automatic profiling keeps every thermal procedure controlled and repeatable.
• PCB preheater. 2800W three-zone medium-wave quartz infrared gives controlled, even thermal conditioning from below.
• PCB workholder. Adjustable support positions the board securely and prevents warping.

Full technical specification

• Max PCB size : 300 × 450 mm
• Max component size : 55 × 55 mm
• Min component size : 01005 package
• Component removal : Hand-held vacuum tool
• Top heater power : 150W focused IR, up to Ø70 mm spot
• PCB preheater power : 2800W medium-wave IR, 3 zones
• Preheater heating area : 360 × 240 mm
• Component sensing : Non-contact IR sensor
• PCB sensing : K-type thermocouple
• Thermocouple channels : 4

Datasheets

Video

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