CHIPMATE AUTO
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Description
Automatic component removal and placement. Suitable for higher volumes, or where the same profile is to be run repeatedly.
DESCRIPTION
- Automatic removal and placement. The system lifts and places components automatically at the precise moment, taking operator variability out of the most delicate step.
- Focused infrared heating. 150W focused, adjustable, visible infrared delivers precise energy exactly where it is needed.
- Independent temperature control. Board and component temperatures are managed separately for precise control of the procedure.
- ThermoActive software. Automatic thermal process management provides an identical and repeatable procedure for each component.
- PCB preheater. 2800W three-zone medium-wave quartz infrared provides controlled and consistent preheating.
- Optical alignment. Accurate placement of removed components supports precise transfer and component replacement.
- Side-view monitoring. Live camera with image capture provides clear process monitoring and records for documentation.
- Flux and paste application. Precise application ahead of transfer or component replacement supports accurate component handling.
- Assisted PCB cooling. Stabilises the board after the procedure for controlled cooling and improved process consistency.
Full technical specification
- Max PCB size : 300 × 450 mm
- Max component size : 55 × 55 mm
- Min component size : 1 × 1 mm
- Component removal : Automatic removal and placement
- Component placement : Split beam prism, ×50 magnification
- Placement accuracy : Up to 10 microns
- Top heater power : 150W focused IR, up to Ø70 mm spot
- PCB preheater power : 2800W medium-wave IR, 3 zones
- Preheater heating area : 360 × 240 mm
- Component sensing : Non-contact IR sensor
- PCB sensing : Non-contact IR sensor
- Thermocouple channels : 4