CHIPMATE
Description
The Chipmate is the entry configuration. Manual operation with a hand-held vacuum tool and thermocouple board sensing, with the full focused infrared heating system.
DESCRIPTION
- Focused infrared heating. 150W focused, adjustable, visible infrared delivers precise energy exactly where it is needed.
- Independent temperature control. Board and component temperatures are managed separately, for full control of the procedure.
- ThermoActive software. Automatic profiling keeps every thermal procedure controlled and repeatable.
- PCB preheater. 2800W three-zone medium-wave quartz infrared gives controlled, even thermal conditioning from below.
- PCB workholder. Adjustable support positions the board securely and prevents warping.
Full technical specification
- Max PCB size : 300 × 450 mm
- Max component size : 55 × 55 mm
- Min component size : 01005 package
- Component removal : Hand-held vacuum tool
- Top heater power : 150W focused IR, up to Ø70 mm spot
- PCB preheater power : 2800W medium-wave IR, 3 zones
- Preheater heating area : 360 × 240 mm
- Component sensing : Non-contact IR sensor
- PCB sensing : K-type thermocouple
- Thermocouple channels : 4